MLPF-WB55-02E3    FLIP CHIP BUMPLESS CSPG

The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

主要特性

• Integrated impedance matching to STM32WB55Vx

• LGA footprint compatible

• 50 Ω nominal impedance on antenna side

• Deep rejection harmonics filter

• Low insertion loss

• Small footprint

• Low thickness ≤ 450 μm

• High RF performance

• RF BOM and area reduction

• ECOPACK2 compliant component